Smart Electronics Peltier thermoelectric cooler 12V,thermoelectric cooler peltier,industrial peltier module

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$1.90 - $2.90 / Pieces | 10 Piece/Pieces (Min. Order)
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Overview
Quick Details
Place of Origin:
Guangdong, China
Brand Name:
Smart
Model Number:
thermoelectric cooler
Used in:
electronics, automobile, aero, chemical, ship hardware,and industries
Standards:
JIS, DIN, ASTM, and BS
Available materials:
cast iron, carbon steel, stainless steel, aluminum,brass, zinc alloy
Supply Ability
Supply Ability:
30000 Piece/Pieces per Month TEC1-12706 40*40MM
Packaging & Delivery
Packaging Details
vacuum package
Port
ShenZhen
Electronics Products
Electronics Products

 

Chip model: TEC1-12703
Dimensions: 40*40*4.0mm±0.1 Component Logarithm 127
Wire size: lead length 310mm ± 5mm RV standard wire single head 5mm tinned
Internal resistance: 4.0~4.3Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: ΔTmax (Qc = 0) 60 ° C or more.
Working current: Imax=3 (when rated voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 27W
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature drop directly affects cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C


Chip model: TEC1-12704
Dimensions: 40*40*4.2mm component logarithm 127
Wire size: lead length 100±5mm RV standard wire single head 5mm tinned
Internal resistance: 3.0~3.3Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: ΔTmax (Qc = 0) 60 ° C or more.
Working current: Imax=4 (when rated voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature will directly affect cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C

 

 

Chip model: TEC1-12705
Dimensions: 40*40*3.8mm Component log 127
Wire size: lead length 100±5mm RV standard wire single head 5mm tinned
Internal resistance: 2.4~2.7Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: Tmax (Qc=0) 61 °C or more.
Working current: Imax=5 (when rated voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 45W
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature will directly affect cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C

 

Chip model: TEC1-12706 (different batches may differ in printing)
External dimensions: 40*40*3.75mm
Internal resistance: 2.1~2.4Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: ΔTmax (Qc = 0) 67 ° C or more.
Working current: Imax=4-6A (when rated at 12V)
Rated voltage: 12V (Vmax: 15V starting current 5.8A)
Cooling power: Qcmax50-60W
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature drop directly affects cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal

 
Chip model: TEC1-12708
Dimensions: 40*40*3.5mm Component log 127
Wire size: lead length 300±8mm RV standard wire single head 5mm tinned
Internal resistance: 1.5~1.8Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: ΔTmax (Qc = 0) 67 ° C or more.
Working current: Imax=8A (when rated voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 77W
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature will directly affect cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C

 

Chip model: TEC1-12709
High current ImaxA: 9A
Large temperature difference Tmax: 68 ° C
Large voltage Vmax (Qc=Ow): 15.2V
Resistance: 1.4Ω
(hot end temperature TH=27°C): 82W
Component log: 127
Dimensions L.B.H(mm): 40*40*3.4±0.1MM

 

Chip model: TEC1-12710
Dimensions: 40*40*3.4mm component logarithm 127
Wire size: lead length 300±5mm RV standard wire single head 5mm tinned
Internal resistance: 1.2~1.5Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: Tmax (Qc = 0) 60 ° C or more.
Working current: Imax=10A (when 15Vmax voltage is started)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 92W
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature will directly affect cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C

 

Chip model: TEC1-12715
Dimensions: 40*40*3.2mm component logarithm 127 pairs
Wire size: lead length 200±8mm RV standard wire single head 5mm tinned
Internal resistance: 0.8~0.9Ω (ambient temperature 23±1°C, 1kHZ Ac test)
Large temperature difference: above 62 °C
Working current: Imax=11.8A (15A for large voltage 15.5V startup)
Rated voltage: DC12V (large voltage: 15.5V)
Cooling power: 142W (the cooling surface temperature is too high will reduce the cooling power)
Assembly pressure: 85N/cm2
Working environment: Temperature range -55 °C ~ 83 °C (excessive ambient temperature will directly affect cooling efficiency)
Packaging process: four weeks standard 704 silicone rubber seal
Packing standard: foam box packaging, storage conditions, ambient temperature -10 ° C ~ 40 ° C
Storage conditions: -40~60°C
Power requirements: single voltage 12V, current 15A or more working power (can be used in series and parallel)
Device characteristics: red line is positive, black line is negative (there is a literal surface for the cooling surface, no literal surface is the heat dissipation surface)

 

 

 

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*Well and high quality control
*Prompt delivery
*Small order acceptable
*Perfect craft procedure
*Customer's designs are welcome

 

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